Flux Paste, SMT Flux Paste, High Temperature Flux Paste manufacturer / supplier in China, offering High Temperature Halogen Free Lead Free Solder Paste Soldering Flux Paste for SMT PCB LED Lf318, Em#75-327W Sn96.0/AG4.0 No Clean Solder Wire with RoHS, Lead Free RoHS Solder Preform with Alloy Sn42/Bi58 and so on.
Electroloy's EMCO#265HF-315P No Clean Solder Paste is a Halogen Free rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. Feature: Probe-testable residue According to IPC J-STD-004 standard ROL0 Provides enhanced activity for the robustness of PCB boards and components Outstanding slump resistance Outstanding adhesion performance and printable time Extended "printing period" interval Bright, colorless residue Halogen-free Chemical composition of the alloy The composition of lead-free tin wire is strictly controlled in the following LF-315 specifications:
Lead-free low-temperature alloys:
Alloy number
Alloy composition
Fuse
Feature
Application
LF-302
Sn42 / Bi58
138°C
Reasonable shear strength and fatigue resistance.
Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.
LF-329
Sn42 / Bi57/Ag1
139°C
The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.
LF-323
Sn64 / Bi35/Ag1
170-190°C
The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.
Lead-free medium temperature alloy:
Alloy number
Alloy composition
Fuse
Feature
Application
LF-307
Sn96.5 / Ag3.0 / Cu0.5
217-219°C
Excellent mechanical properties and thermalfatigue performance.
Standard SAC alloy for most SMT applications.
LF-315
Sn99 / Ag0.3 / Cu0.7
216-228°C
Excellent mechanical properties and thermal fatigue performance.
Low cost SAC alloy for most SMT applications.
SN100C
Sn99.3/Cu0.6/Ni+Ge
227°C
Excellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance.
SnCu alloy instead of SAC alloy for most SMT applications.
Paste flux
Alloy number
Feature
Flux classification
EM#502 (HF)
Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
ROL0
EM#503PT (HF)
Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
ROL0
EM#615
Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards.
ROL1
EM#233
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue.
ROL1
EM#255
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases.
ROL1
EM#265 (HF)
Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance.
Electroloy's EMCO#265HF-315P No Clean Solder Paste is a Halogen Free rosin based solder paste with a wide print process window and extremely long abandon and open time. The soft non-stick residues improve reliability of in-circuit testing and reduce the frequency of test probes cleaning. Feature: Probe-testable residue According to IPC J-STD-004 standard ROL0 Provides enhanced activity for the robustness of PCB boards and components Outstanding slump resistance Outstanding adhesion performance and printable time Extended "printing period" interval Bright, colorless residue Halogen-free Chemical composition of the alloy The composition of lead-free tin wire is strictly controlled in the following LF-315 specifications:
Lead-free low-temperature alloys:
Alloy number
Alloy composition
Fuse
Feature
Application
LF-302
Sn42 / Bi58
138°C
Reasonable shear strength and fatigue resistance.
Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations.
LF-329
Sn42 / Bi57/Ag1
139°C
The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue.
LF-323
Sn64 / Bi35/Ag1
170-190°C
The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue.
Lead-free medium temperature alloy:
Alloy number
Alloy composition
Fuse
Feature
Application
LF-307
Sn96.5 / Ag3.0 / Cu0.5
217-219°C
Excellent mechanical properties and thermalfatigue performance.
Standard SAC alloy for most SMT applications.
LF-315
Sn99 / Ag0.3 / Cu0.7
216-228°C
Excellent mechanical properties and thermal fatigue performance.
Low cost SAC alloy for most SMT applications.
SN100C
Sn99.3/Cu0.6/Ni+Ge
227°C
Excellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance.
SnCu alloy instead of SAC alloy for most SMT applications.
Paste flux
Alloy number
Feature
Flux classification
EM#502 (HF)
Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
ROL0
EM#503PT (HF)
Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue.
ROL0
EM#615
Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards.
ROL1
EM#233
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue.
ROL1
EM#255
Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases.
ROL1
EM#265 (HF)
Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance.
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