Flux Paste, SMT Flux Paste, High Temperature Flux Paste manufacturer / supplier in China, offering High Temperature Halogen Free Lead Free Solder Paste Soldering Flux Paste for SMT PCB LED Lf318, Emsf-231UV-T and Emsf-232UV-T One-Component UV Light Curing Adhesive, Low Temperature Lead Free Low Temparution Solid Solder Wire with Alloy Composition 42% Tin and 58% Bismuth RoHS and so on.
| Min. Order / Reference FOB Price | 1 Piece | US $1-10/ Piece |
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| Port: | Shenzhen, China
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| Production Capacity: | 100mt/Year |
| Payment Terms: | T/T |
| Ingredient: | Lead Free |
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| Performance: | High Temperature |
| Application: | SMT PCB LED Lf318 |
| Transport Package: | 0.5kg/Jar |
| Specification: | Sn98.5/Ag1.0/Cu0.5 |
| Trademark: | ELECTROLOY |
Alloy number | Alloy composition | Fuse | Feature | Application |
| LF-302 | Sn42 / Bi58 | 138°C | Reasonable shear strength and fatigue resistance. | Can be used for temperature-sensitive parts and LED welding operations.Can be used for multi-step welding and fuse-like fuses operations can also be used for nozzle and exhaust valve operations. |
| LF-329 | Sn42 / Bi57/Ag1 | 139°C | The addition of silver enhances its mechanical properties, with excellent resistance to thermal fatigue. | |
| LF-323 | Sn64 / Bi35/Ag1 | 170-190°C | The addition of silver enhances its mechanical properties, with excellentresistance to thermal fatigue. | |
Alloy number | Alloy composition | Fuse | Feature | Application |
| LF-307 | Sn96.5 / Ag3.0 / Cu0.5 | 217-219°C | Excellent mechanical properties and thermalfatigue performance. | Standard SAC alloy for most SMT applications. |
| LF-315 | Sn99 / Ag0.3 / Cu0.7 | 216-228°C | Excellent mechanical properties and thermal fatigue performance. | Low cost SAC alloy for most SMT applications. |
| SN100C | Sn99.3/Cu0.6/Ni+Ge | 227°C | Excellent mechanical properties, bright and smooth solder joints.Excellent through-holesoldering performance. | SnCu alloy instead of SAC alloy for most SMT applications. |
Alloy number | Feature | Flux classification |
| EM#502 (HF) | Halogen-free flux, with high shear strength and excellent printing ability.Can also be used for high-speed printing operations.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue. | ROL0 |
| EM#503PT (HF) | Halogen-free flux, with high shear strength and excellent printing ability.Has excellent anti-collapse performance and excellent adhesion performance.Its flux can withstand high preheat temperatures, which show excellent wetting on most circuit boards, leaving only clean residue. | ROL0 |
| EM#615 | Specially configured flux with excellent printability for ultra-fine pitch welding operation.Its flux can withstand high preheat temperatures and a wide range of operational reflow jobs.It shows excellent wetting on most circuit boards. | ROL1 |
| EM#233 | Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.Has excellent anti-collapse performance and excellent adhesion performance.It shows excellent wetting on most circuit boards and leaves only clean residue. | ROL1 |
| EM#255 | Specially configured flux enhances activity on difficult-to-solder circuit boards and parts.It shows excellent wetting on most circuit boards.Has excellent anti-collapse performance and excellent adhesion performance.The residue is soft, non-sticky; can be operated on probe test.Residues are clean, printing takes longer and productivity increases. | ROL1 |
| EM#265 (HF) | Halogen-free formulations, temperature range can be widely used, printing operation for a long time.Soft, non-stick residue enhances reliability during in-circuit testing and reduces test probe cleaning frequency.Has excellent anti-collapse performance and excellent adhesion performance. | ROL0 |
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